专利摘要:
decoder apparatus having microperforations. the decoder apparatus includes an outer shell having microperforations, an inner bottom frame having a centrally located heat sink, a circuit panel on the bottom frame and a heat dissipating element with skylights on the circuit panel and in thermal contact with the heat sink of heat.
公开号:BR112012014093B1
申请号:R112012014093-0
申请日:2010-12-02
公开日:2020-09-29
发明作者:Darin Bradley Ritter;Mickey Jay Hunt;Mark William Gysin
申请人:Interdigital Ce Patent Holdings;
IPC主号:
专利说明:

Cross-reference with related orders
This order claims priority from U.S. Interim Order No. 2. serial number 61/283815 deposited on December 9, 2009, which is incorporated herein by reference in its entirety. Field of invention
The present invention relates to decoding devices. Background of the invention
decoder devices continue to be in high demand and there is an increasing need to reduce the size and improve the aesthetic appearance, performance and robustness of these devices and the like.
The particular problem facing decoder devices is damage due to liquid ingress, insect ingress, and heat generation. However, ventilation openings, which are often used for heat dissipation, unfortunately increase the opportunity for liquid and insect entry. As such, there is a need to address each of these problems without creating or increasing other problems.
An additional consideration in designing set-top boxes to keep in mind is the consumer's preference for smaller set-top boxes that are quiet, attractive, and mechanically and electrically robust. Because fans of heat dissipation, which would tend to improve the electrical robustness of the decoder devices, introduce noise and increase the size of the decoder devices, there is a need for a design that can be robust but still satisfy consumer preference. Summary of the invention
An electronic device having aspects that remove heat and prevent the entry of liquid and insects comprises an outer shell having an upper part and a lower part in which the outer shell has perforations on either side. The device further includes a lower frame within the outer shell in which the lower frame has a heatsink surrounding a peripheral area and the heatsink can be raised in relation to the peripheral area, where the peripheral area may have openings. A lower electronic component or circuit board is on the lower frame and a heat dissipating element can be on the inner electronic component. The heat dissipating element can have a central region in thermal contact with the heat sink and a peripheral part in which the peripheral part has shutters, in which the central region can be compressed in relation to the peripheral part and the internal electronic component or The circuit board has a thermal contact region that allows the heatsink and the central region to be in thermal contact. The blinds can be oriented in more than one direction and can be oriented to be directed towards the front, back and sides of the device. The bottom frame may have two opposite side walls, each having openings and closures adjacent to the openings, where the openings are designed to accommodate engaging elements of the outer end caps of the device. The engagement elements engage the latches through the openings that lock the end caps on the bottom frame and where the latches can be narrower than the engagement elements along a vertical dimension. The lower frame may also have a rear wall having unlocking openings adapted to allow the release pins of a release tool to enter through and release the locking elements of the latches, thereby allowing the end caps to be unlocked from the lower frame . The perforations in the housing can have opening dimensions in the range of 0.5 to 1 mm. In addition, the heat-removing features that include the heat sink, heat sink element and perforations are designed to work without the need for a fan. The heat removal capabilities can be improved by providing a base support that allows the device support vertically such that the top and bottom of the outer shell are oriented vertically. Brief description of the drawings
The invention will now be described by way of example with reference to the accompanying figures of which: Figure 1 shows an inner bottom frame 10 having a centrally located heat sink 11 according to the invention; Figure 2 shows a heatsink element with blinds 20 having an elevated part 21 and a lower central region 22 according to the invention; Figure 3 shows an interior view of a set-top box 30 according to the invention; Figure 4 is an exploded view of the main components of the deco-fixing apparatus 30 according to the invention; Figure 5 is a view of the inner lower frame 10 with end caps 34 engaged; Figure 6 shows a series of enlarged views of the corner 17 of the inner lower frame 10 showing how the end caps are engaged; Figure 7 is a view of the application of a release tool 40 on the decoder apparatus according to the invention; Figure 8 shows a series of enlarged views of the corner 17 of the lower inner frame showing how the end caps are disengaged; Figure 9 shows the microperforation aspect of the outer shell; and Figure 10 shows a view of the decoder apparatus 30 in a vertical orientation. Detailed description of the modalities
The decoder apparatus 30 or similar according to the invention includes outer shell 31 having microperforations 36, an inner bottom frame 10 having a centrally located heat sink 11, a circuit panel 24 or the like in the bottom frame 10, and a dissipating element heaters with blinds 20 on the circuit board 24 and in internal contact with the heatsink 11.
Figure 1 shows the inner bottom frame 10 of the decoder 30 having the heat sink centrally located 11.0 heat sink 11 may be slightly off center and is preferably elevated from the base part 18 of the frame 10. The frame 10 can also have upright side walls 19s, a rear wall 19r, spacers 12 to support internal components, and openings 13 for improved heat flow and distribution.
Figure 2 shows a heat dissipating element with shutters 20 which must be mounted parallel to the base part 18 of the inner bottom frame 10 and preferably on the frame 10. Figure 2 includes in view the circuit panel 24 which can be located between the base part 18 and the heatsink element with blinds 20. The heatsink element with blinds 20 preferably has a peripheral part 21 surrounding a central region 22, where the central region 22 can be bypassed towards the heat sink 11 and the central region is aligned with the heat sink 11 and is in thermal contact with the heat sink 11. The expression “central” can mean that the region is exactly centered or substantially centered, but it also intends to imply that the component is not on an edge and is surrounded by some other region. As shown in Figure 2, the peripheral part 21 is preferably elevated and that the blinds are directed 23 in various directions to improve the heat distribution. In Figure 2, there are blinds 23 directed to the front, back, left and right of the decoder device.
Figure 3 shows a perspective cross-sectional view of a set-top box 30 according to an embodiment of the invention. Figure 3 shows the outer shell 31. In particular, Figure 3 shows how the inner bottom frame, the circuit panel 24, and the louvered heat dissipating element 20 are positioned between the top 32 and the bottom 33 of the outer casing 31. This view still shows the central region 22 being in thermal contact with the heatsink 11 through the circuit panel 24.
Figure 4 is an exploded view of the main components of the deco-fixing apparatus 30 according to an embodiment of the invention. This view also shows how the inner bottom frame, the circuit panel 24 and the heat dissipating element with blinds 20 can be positioned with the outer housing 31. Ideally, the decoder apparatus according to the invention is assembled as follows: ( 1) assemble and connect the inner lower frame 10, circuit panel 24, and heat dissipation element with shutters 20 together; (2) insert this assembly in the outer shell 31; and (3) lock the entire assembly closed with the end caps 31 that fit the side walls 19 of the lower frame 10.
Figure 4 also shows the circuit panel 24 with a thermal contact 25. This thermal contact 25 can be in contact with the central region 22 of the heatsink element with blinds 20 and the heatsink 11 of the lower frame 10. The thermal contact 25 also helps to extract heat directly from circuit panel 24. Optionally, circuit panel 24 can have a central hole which can allow central region 22 and heat sink 11 to contact directly.
Figure 4 also shows that the decoder apparatus 30 may have a smart card reader 91 in the circuit panel 24 and a smart card input slot 92 in a terminal cover 34 for a smart card 90.
Figures 5 and 6 provide views showing how the end caps 34 lock the entire assembly or complete the set-top box 30. Figure 5 shows in particular how the bottom frame 10 and end caps 34 engage to complete the set-top box. The outer shell 31 and other components are not shown in Figures 5 and 6 to simplify the engagement mechanism. However, in a mounted device, the left and right end caps 34 ideally fit snugly over and around the corresponding peripheral edges of the outer shell 31.
The corner section 17 in Figure 5 of the bottom frame with the locking mechanism is shown in Figure 6A. Figure 6A shows in particular the side wall 19, the side wall opening 15, the side wall closures 16 adjacent to the opening 15. The closures 16 are preferably located on the inner side of the side wall 19. Figure 6B shows the application of end cap 34 on side wall 19, where end cap 34 has an engaging element 35 on the underside of end cap 34 which inserts through side wall opening 15 in an inward motion 60. Figure 6C then shows the cap terminal 34 being slid in a backward motion 63 such that the latch member 35, which preferably has a latch hook, elastically engages and snaps into the side wall latches 16, thereby locking the end caps 34 on the bottom frame 10. It is not shown in the figures the feature of the end caps 34 also engaging the side walls and / or the outer shell 31 away from the rear of the decoder 30 to ensure that the end caps are in close proximity. along the length of the side wall 19.
Figures 7 and 8 provide additional views showing how the end caps 34 can be unlocked to disassemble the decoder 30 for maintenance, diagnostics, or electronic component updates. As shown in Figure 7, one embodiment of the invention is the decoder 30 feature requiring disengagement tool 40 to disassemble the decoder apparatus 30. This helps to ensure that the decoder apparatus 30 will only be disassembled by a qualified technician in possession of the tool 40. With respect to tool 40, it has release pins 4 that are inserted into unlock openings 14 in the rear wall 19r of the bottom frame 10 in a forward movement 61 as shown in Figure 7. This forward movement 61 makes the unlocking pins 41 penetrate between the interior of the side wall 19 and the engagement element 35 causing the engagement element 35 to flex in an inward motion 60. The release pins 41 are preferably in pairs and configured to release the side wall closures 16 and have the side wall locks between the pair as shown in Figure 8B. Figure 8B also shows that with the engagement element 35 flexed inwardly, the end caps 34 can be slid in a forward motion 61. This allows the engagement element 35 to align with the side wall opening 15 such that the end caps 34 can be removed in an outward motion 62, as shown in Figure 8C and removed, thereby opening the assembly.
Figure 9A shows the additional appearance of microperforations 36 in the outer shell 30 that allow heat to escape and still prevent insects and liquids from entering the decoder 30. Figure 9B shows how liquids 70 form a puddle on the outer side 39 of the outer shell 31 in microperforations, and do not enter the decoder 30. Figure 9C shows how heat 71 is allowed to escape from the inner side 38 through microperforations 36 to the outer side 39 of the decoder 30. The design achieves the goal of dissipating the entire advantage of energy throughout the integrated assembly without causing the outer side 39 of the outer shell 30 to go beyond the desired temperatures. Furthermore, although the invention can work in conjunction with a fan, in a preferred embodiment there are no fans in the decoder 30 and no fan is required.
Optionally, the material of the outer shell 31 must be dimensioned so that the desired benefits can be obtained with a preference for the diameter of the holes being no larger than 1 mm and preferably in the range of 05 to 1 mm. Although the optimum shape of the microperforation is circular, the other shapes are within the scope of the invention, where the optimum size should have the longest dimension being 1 mm or less, and the shortest dimension being 0.5 mm or greater.
In summary, the invention provides a number of advantages. First of all it provides a barrier that uses the natural phenomenon of surface tension to resist the entry of liquid. This barrier further prevents infestation or entry of any other foreign objects or matter. In addition, the invention provides a breathable or porous outer shell that allows heat to be removed.
It should be understood that in a preferred embodiment, the only openings inside the decoder apparatus are the microperforations. As such, it should be understood that there are other openings shown such as the unlocking openings 14, that there are leak-proof seals or appropriate barriers to prevent liquids or insects from entering.
A further aspect of the invention is that the decoder apparatus 30 can be mounted vertically on a base support 80 as shown in Figure 10, such that the decoder apparatus 30 has one of the side walls 19, 19s, 19r parallel to the ground. The benefit of this aspect is that the vertical orientation can facilitate the escape of heat faster. Furthermore, the vertical orientation may allow the decoder 30 to be hidden or placed in a greater variety of locations.
It is to be understood that, although the examples of the claimed inventions do not specifically mention set-top boxes and circuit boards, the invention is not limited to these aspects. For example, the invention is applicable to computers and other electronic devices having components generating heat. In addition, the invention is also applicable to electronic parts other than circuit boards that can generate heat.
权利要求:
Claims (20)
[0001]
1. An electronic device (30) comprising: an external housing (31) having an upper part (32) and a lower part (33), said external housing having heat ventilation perforations (36); CHARACTERIZED by: a lower frame (10) within said outer shell, said lower frame having a heat sink (11) surrounded by a peripheral area; an interior electronic component (24) on the bottom frame; and a heat dissipating element (20) on the interior electronic component, said heat dissipating element having a central region (22) in thermal contact with the heat sink and having a peripheral part (21), said part peripheral having blinds (23), wherein said heat dissipating element is under the upper part.
[0002]
2. Electronic device, according to claim 1, CHARACTERIZED by the fact that the perforations have a maximum opening dimension of 1 mm.
[0003]
3. Electronic device, according to claim 1, CHARACTERIZED by the fact that the perforations have opening dimensions in the range of 0.5 to 1 mm.
[0004]
4. Electronic device, according to claim 1, CHARACTERIZED by the fact that the heat sink is high in relation to the peripheral area.
[0005]
5. Electronic device, according to claim 4, CHARACTERIZED by the fact that the central region is compressed in relation to the peripheral part.
[0006]
6. Electronic device, according to claim 5, CHARACTERIZED by the fact that the perforations have an opening dimension no greater than 1 mm.
[0007]
7. Electronic device, according to claim 5, CHARACTERIZED by the fact that the perforations have an opening dimension in the range of 0.5 to 1 mm.
[0008]
8. Electronic device, according to claim 5, CHARACTERIZED by the fact that there are at least four blinds of the blinds oriented each oriented in different directions.
[0009]
9. Electronic device, according to claim 8, CHARACTERIZED by the fact that the perforations have opening dimensions in the range of 0.5 to 1 mm.
[0010]
10. Electronic device according to claim 5, CHARACTERIZED by the fact that it additionally comprises a base support, in which a side wall of the lower frame is positioned on the support so that the upper and lower parts of the housing external are vertically oriented.
[0011]
11. Electronic device, according to claim 10, CHARACTERIZED by the fact that the perforations have opening dimensions in the range of 0.5 to 1 mm.
[0012]
12. Electronic device, according to claim 1, CHARACTERIZED by the fact that the central region is compressed in relation to the peripheral part.
[0013]
13. Electronic device, according to claim 1, CHARACTERIZED by the fact that the interior electronic component is a circuit panel and has a thermal contact region that allows the heat sink and the central region to be in thermal contact .
[0014]
14. Electronic device, according to claim 1, CHARACTERIZED by the fact that at least one blind of the blinds is oriented in one direction and at least one other blind of the blinds is oriented in another direction.
[0015]
15. Electronic device, according to claim 1, CHARACTERIZED by the fact that the peripheral area has at least one opening.
[0016]
16. Electronic device, according to claim 1, CHARACTERIZED by the fact that: the bottom frame has two opposite side walls, each having openings and closures adjacent to said openings; and the electronic device further comprises end caps having latching elements which engage the latches through said openings, thereby locking the end caps on the lower frame.
[0017]
17. Electronic device, according to claim 16, CHARACTERIZED by the fact that: the locks are narrower than the coupling elements along a vertical dimension; and the lower frame has a rear wall having configured unlocking openings to allow unlocking pins to enter through and release the locking elements of the latches, thereby allowing the end caps to be unlocked from the lower frame.
[0018]
18. Electronic device, according to claim 17, CHARACTERIZED by the fact that there are at least four blinds of the blinds oriented each in different directions.
[0019]
19. Electronic device, according to claim 17, CHARACTERIZED by the fact that the electronic device does not have a fan.
[0020]
20. Electronic device, according to claim 1, FEATURED by the fact that there are at least four blinds of the blinds oriented each in different directions.
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引用文献:
公开号 | 申请日 | 公开日 | 申请人 | 专利标题

US4887147A|1987-07-01|1989-12-12|Digital Equipment Corporation|Thermal package for electronic components|
JPH06227553A|1993-01-28|1994-08-16|Yazaki Corp|Locking structure|
US5620242A|1993-04-19|1997-04-15|Motorola, Inc.|Portable radio battery latch|
JP3251734B2|1993-08-18|2002-01-28|株式会社日立テレコムテクノロジー|Electronic device housing structure|
US5917236A|1995-12-08|1999-06-29|Hewlett-Packard Company|Packaging system for field effects transistors|
JP3776169B2|1996-06-13|2006-05-17|任天堂株式会社|Heat dissipation structure of electronic equipment|
US6049469A|1997-08-20|2000-04-11|Dell Usa, L.P.|Combination electromagnetic shield and heat spreader|
US7082033B1|1998-02-13|2006-07-25|Micron Technology, Inc.|Removing heat from integrated circuit devices mounted on a support structure|
US6021044A|1998-08-13|2000-02-01|Data General Corporation|Heatsink assembly|
JP2000269675A|1999-03-19|2000-09-29|Sony Corp|Cooling device and set top box|
JP3982941B2|1999-04-12|2007-09-26|富士通株式会社|Storage device|
GB2355017B|1999-09-23|2001-09-12|Lorenzo Battisti|Porous element|
US6850252B1|1999-10-05|2005-02-01|Steven M. Hoffberg|Intelligent electronic appliance system and method|
JP2001358482A|2000-04-14|2001-12-26|Matsushita Refrig Co Ltd|Heat radiative module|
US20020051338A1|2000-07-27|2002-05-02|Lixin Jiang|Acoustic enclosure for an air cooled hard disk drive|
DE10051159C2|2000-10-16|2002-09-19|Osram Opto Semiconductors Gmbh|LED module, e.g. White light source|
US6524361B1|2000-10-26|2003-02-25|Hubbell Incorporated|Micro-porous filter|
EP1248507A1|2001-04-04|2002-10-09|Siemens Aktiengesellschaft|High frequencies module for audio device with improved heat dissipation|
JP4057796B2|2001-07-03|2008-03-05|株式会社東芝|Non-aqueous electrolyte air battery|
US6735085B2|2002-08-15|2004-05-11|Hon Hai Precision Ind. Co., Ltd.|Foldable retention device for land grid array connector assembly|
US20050128710A1|2003-12-15|2005-06-16|Beiteimal Abdlmonem H.|Cooling system for electronic components|
TWI256192B|2004-04-15|2006-06-01|Acbel Polytech Inc|Power adapter with heat sink device|
FR2875917B3|2004-09-29|2007-01-05|Alvaro Lemos|FOLDING VENTILATION DEVICE FOR THE PROTECTION OF PORTABLE MICROCOMPUTERS|
TWI247574B|2004-11-30|2006-01-11|Silicon Integrated Sys Corp|Heat dissipation mechanism for electronic device|
US7791874B2|2004-12-30|2010-09-07|Microsoft Corporation|Removable module for a console|
JP2006229046A|2005-02-18|2006-08-31|Toshiba Corp|Heat radiator and heat radiating method for electronic apparatus|
JP4445409B2|2005-02-23|2010-04-07|株式会社東芝|Heat dissipation device for electronic equipment|
US7158380B2|2005-03-25|2007-01-02|Scientific-Atlanta, Inc.|Heatsink for digital video recorder|
WO2007089321A2|2005-11-23|2007-08-09|Comcast Cable Holdings, Llc|Settop box |
US20070177356A1|2006-02-01|2007-08-02|Jeffrey Panek|Three-dimensional cold plate and method of manufacturing same|
US7450387B2|2006-03-02|2008-11-11|Tdk Innoveta Technologies, Inc.|System for cooling electronic components|
US7664198B2|2006-03-21|2010-02-16|Kyocera Corporation|System and method for broadcasting data over a wireless network using rateless codes|
US7518875B2|2006-12-14|2009-04-14|International Business Machines Corporation|Securing heat sinks to a device under test|
CN101663673B|2007-05-04|2016-09-07|汤姆逊许可证公司|Intelligent card heat dissipating device|
WO2009057124A2|2007-11-01|2009-05-07|Innomedia Technologies Pvt. Ltd.|A set-top-box cabinet for natural cooling of internal electronics|
JP4857252B2|2007-12-07|2012-01-18|株式会社日立製作所|Electronics|
JP4473923B2|2008-10-22|2010-06-02|株式会社東芝|Electronics|
FR2944408B1|2009-04-14|2012-09-21|Eads Europ Aeronautic Defence|BOX FOR ELECTRONIC BOARD EMBARCATED|
KR20120129885A|2009-12-09|2012-11-28|톰슨 라이센싱|Set-top box having microperforations|
WO2011106082A1|2010-02-25|2011-09-01|Thomson Licensing|Miniature multilayer radiative cooling case with hidden quick release snaps|
KR20130077841A|2010-05-19|2013-07-09|톰슨 라이센싱|Set-top box having dissipating thermal loads|
USD631449S1|2010-08-02|2011-01-25|Thomson Licensing|Set top box|
KR20140061299A|2011-03-09|2014-05-21|톰슨 라이센싱|Set top box or server having snap-in heat sink and smart card reader|KR20120129885A|2009-12-09|2012-11-28|톰슨 라이센싱|Set-top box having microperforations|
WO2011106082A1|2010-02-25|2011-09-01|Thomson Licensing|Miniature multilayer radiative cooling case with hidden quick release snaps|
KR20130077841A|2010-05-19|2013-07-09|톰슨 라이센싱|Set-top box having dissipating thermal loads|
KR20140061299A|2011-03-09|2014-05-21|톰슨 라이센싱|Set top box or server having snap-in heat sink and smart card reader|
BR112013022659A2|2011-03-09|2016-12-06|Thomson Licensing|set-top box converter with reset button and light guide|
EP2732684B1|2011-07-14|2022-01-12|Thomson Licensing|Set top box having snap-in heat sink and smart card reader with a hold down for retaining the heat sink|
CN103891300A|2011-10-19|2014-06-25|汤姆逊许可公司|Remote control with feedback for blind navigation|
US20150077925A1|2012-04-13|2015-03-19|Thomson Licensing|Set top box having removable hard drive|
US9007773B2|2012-08-31|2015-04-14|Flextronics Ap, Llc|Housing unit with heat sink|
CN102864589B|2012-10-10|2015-04-22|浙江中科德润科技有限公司|Integral type controller of industrial sewing machine|
TW201444460A|2013-05-14|2014-11-16|Hon Hai Prec Ind Co Ltd|Heat sink assembly|
WO2014209316A1|2013-06-27|2014-12-31|Thomson Licensing|Device cover for thermal management|
EP3069586B1|2013-11-13|2017-09-20|Thomson Licensing|Heatsink alignment to printed circuit board|
US10004150B2|2014-05-07|2018-06-19|Thomson Licensing|Vertical electronic device and modular unit|
WO2016018544A1|2014-07-30|2016-02-04|Thomson Licensing|Heatsink push pin ground/attachment method|
JP2017532679A|2014-09-25|2017-11-02|トムソン ライセンシングThomson Licensing|Electronic devices|
CN105578839B|2014-10-17|2019-03-15|中兴通讯股份有限公司|Communication system and its communication equipment|
CN107710504B|2015-04-20|2021-03-05|交互数字麦迪逊专利控股公司|Vertically oriented electronic device, method of constructing and method of constructing a subassembly|
US20180151950A1|2015-04-20|2018-05-31|Thomson Licensing|Antenna mounting bracket with air deflecting curvature|
US9760742B2|2015-06-26|2017-09-12|Echostar Technologies L.L.C.|Dual purpose press-bar and heat sink for high data transfer integrated circuit card reader|
US10356948B2|2015-12-31|2019-07-16|DISH Technologies L.L.C.|Self-adjustable heat spreader system for set-top box assemblies|
US10043043B1|2017-02-07|2018-08-07|DISH Technologies L.L.C.|Integrated circuit card reader with improved heat dissipation|
US10721840B2|2017-10-11|2020-07-21|DISH Technologies L.L.C.|Heat spreader assembly|
CN108616765B|2018-04-08|2020-11-24|江苏盛斗士网络技术有限公司|Set top box with dustproof function|
JP2021158287A|2020-03-27|2021-10-07|株式会社ソニー・インタラクティブエンタテインメント|Electronic apparatus and exterior panel thereof|
法律状态:
2019-01-08| B06F| Objections, documents and/or translations needed after an examination request according art. 34 industrial property law|
2019-08-06| B25G| Requested change of headquarter approved|Owner name: THOMSON LICENSING (FR) |
2019-08-20| B25A| Requested transfer of rights approved|Owner name: INTERDIGITAL CE PATENT HOLDINGS (FR) |
2019-09-10| B06U| Preliminary requirement: requests with searches performed by other patent offices: suspension of the patent application procedure|
2020-07-07| B09A| Decision: intention to grant|
2020-09-29| B16A| Patent or certificate of addition of invention granted|Free format text: PRAZO DE VALIDADE: 20 (VINTE) ANOS CONTADOS A PARTIR DE 02/12/2010, OBSERVADAS AS CONDICOES LEGAIS. |
优先权:
申请号 | 申请日 | 专利标题
US28381509P| true| 2009-12-09|2009-12-09|
US61/283.815|2009-12-09|
PCT/US2010/003080|WO2011071516A1|2009-12-09|2010-12-02|Set-top box having microperforations|
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